ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,107, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,108, issued on Aug. 25, was assigned to Orbotech Ltd. (Yavne, Israel). "VIOS modulator sensitivity for micro LED backplane array electrical... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,109, issued on Aug. 25, was assigned to MITSUI CHEMICALS ICT MATERIA INC. (Tokyo). "Electronic component manufacturing method, manufacturin... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,110, issued on Aug. 25, was assigned to Wolfspeed Inc. (Durham, N.C.). "Methods and systems for component analysis, sorting, and sequencing... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,111, issued on Aug. 25, was assigned to KLA Corp. (Milpitas, Calif.). "Mini environment instrumented wafer" was invented by Giampietro Biel... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,112, issued on Aug. 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Probe card for connecting to contact pads configured to ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,113, issued on Aug. 25, was assigned to Seoul National University R&DB Foundation (Seoul, South Korea). "Silver nanowire thin-film patterni... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,114, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for processing a substrate" was invented by Eric Chih-Fang Liu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,115, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Photo mask and lithography meth... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,116, issued on Aug. 25, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Substrate processing method" was invented by Seungju Ch... Read More